Back to matchesWe found a matchYour institution may have rights to this item. Sign in to continue.TitleEffects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM.AuthorsZhu, Qing-Sheng; Guo, Jian-Jun; Shang, Pan-Ju; Wang, Zhong-Guang; Shang, Jian-KuPublicationAdvanced Engineering Materials, 2010, Vol 12, Issue 6, p497ISSN1438-1656Publication typeArticleDOI10.1002/adem.200900294