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- Title
Diffusion wave model and growth kinetics of interfacial intermetallic compounds in Sn-3.0Ag-0.5Cu-xTiO solder joints.
- Authors
Tang, Y.; Li, G.; Luo, S.; Wang, K.; Zhou, B.
- Abstract
The growth kinetics of the interfacial intermetallic compounds (IMCs) between Sn-3.0Ag-0.5Cu-xTiO composite solder and Cu substrate during reflow process has been investigated in this work. Scanning electron microscope was adopted to observe the microstructure evolution of solder joints and measure the thickness of the interfacial IMC layer. The IMC phases were identified by energy-dispersive X-ray spectroscopy and X-ray diffractometry. Results show that both the reflow time and nano-TiO addition affects the microstructural morphology of IMCs. The thickness of CuSn IMC was observed to increase with an increase in the reflow time, decrease with nano-TiO addition, and has a significant drop with the nano-TiO proportion of about 0.1 wt%. The growth of IMC layer was found to deviate the classical Fick's diffusion law at the early stages of the IMC growth and then to approach the parabolic law. To explore the interfacial IMC growth kinetics, a diffusion wave model was proposed for predicting the IMC growth. Results show that the theoretical model was well consistent with the experimental data, which shows the feasibility of the model to predict the interfacial IMC growth for Sn-3.0Ag-0.5Cu-xTiO solder joints in the reflow process.
- Subjects
INTERMETALLIC compounds; SOLDER joints; MATHEMATICAL models of diffusion; MICROSTRUCTURE; X-ray spectroscopy; FICK'S laws of diffusion; REFLOW soldering
- Publication
Journal of Materials Science: Materials in Electronics, 2015, Vol 26, Issue 5, p3196
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-015-2817-6