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- Title
Effects of Phosphorus Content on the Reaction of Electroless Ni-P with Sn and Crystallization of Ni-P.
- Authors
Sohn, Y. C.; Jin Yu; Kang, S. K.; Shih, D. Y.; Choi, W. K.
- Abstract
The reaction between electroless Ni-P and Sn and the crystallization behavior of Ni-P were investigated to better understand the effect of P content on the Ni-P layer. Electroless Ni-P specimens with three different P contents, 4.6 wt.%, 9 wt.%, and 13 wt.%, were used to study the effect of the P content and the microstructure of Ni-P on the subsequent crystallization and intermetallic compound (IMC) formation during the reaction between Ni-P and electroplated Sn. Ni3Sn4 was the major phase formed in all samples heated up to 300°C, which totally transformed into Ni3Sn2 when samples were heated up to 450°C and the Sn layer was 0.5-µm thick. The IMC formed on the nanocrystalline Ni-P showed stronger texture compared to that formed on the amorphous Ni-P. Both the IMC thickness and density decreased with P content in the Ni-P layer, and Ni3Sn4 morphologies varied with P content. Dissolution of Ni into Sn increased with P content, which made IMC size in the bulk Sn increase with P content.
- Subjects
NICKEL; PHOSPHORUS; SILICON; CRYSTALLIZATION; INTERMETALLIC compounds; NICKEL films; METALLIC films
- Publication
Journal of Electronic Materials, 2004, Vol 33, Issue 7, p790
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-004-0243-2