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- Title
MAKING CENTS.
- Authors
Devlin, Liam
- Abstract
The article presents information regarding the conditions wherein components operating in the 60 GHz band and at E-Band will be available. It states that with advances in both chip-scale packaging technology and PCB technology, components operating in the two bands will ultimately be available in Surface Mount Technology (SMT) packages.
- Subjects
SURFACE mount technology; TECHNOLOGICAL innovations; ELECTRONIC packaging; INTEGRATED circuits; PRINTED circuits
- Publication
Microwave Journal, 2012, Vol 55, Issue 7, p32
- ISSN
0192-6225
- Publication type
Article