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- Title
Thermal behavior of epoxy blends for light emitting diode encapsulation.
- Authors
Tan, Seah-Guan; Chow, Wen-Shyang
- Abstract
Epoxy encapsulant with high glass transition temperature (Tg) is required to ensure light emitting diode (LED) functions properly during its service life. Epoxy blends (cycloaliphatic epoxy, diglycidyl ethers of bisphenol-A and novolac resin) were thermally cured using methylhexahydrophthalic anhydride. Effects of the three types epoxy resins on the Tg of the ternary blends were examined. The Tg was mainly controlled by the concentration of cycloaliphatic epoxy. Optimization with constraint was conducted to produce epoxy blends formulation with optimum Tg. It was found that linear mixture model can fit well the experimental Tg of the epoxy ternary blends.
- Subjects
EPOXY compounds; ALICYCLIC compounds; EPOXIDATION; PLASTIC embedment of electronic equipment; LIGHT emitting diode manufacturing; LIGHT emitting diode design &; construction; SERVICE life
- Publication
e-Polymers, 2012, Issue 91, p1
- ISSN
1618-7229
- Publication type
Article