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- Title
On the Asymmetric Growth Behavior of Intermetallic Compound Layers During Extended Reflow of Sn-Rich Alloy on Cu.
- Authors
Yazzie, Kyle; Topliff, Jonathan; Chawla, Nikhilesh
- Abstract
When solder interconnects are fabricated, a Sn-based alloy is melted between two substrates with metallization layers, such as Cu or Ni. From the reaction between Sn and Cu, a CuSn intermetallic compound (IMC) layer is formed at the solder/Cu interfaces. The morphology of the IMC layer greatly influences the mechanical behavior of the solder joint. Here, we report on the characterization of a novel, asymmetric growth behavior of IMC layers in Sn-3.9Ag-0.7Cu solder joints, based on gravity-induced spalling of the IMC.
- Subjects
SOLDER &; soldering; ALLOYS; MECHANICAL behavior of materials; MECHANICS (Physics); SOLDER joints
- Publication
Metallurgical & Materials Transactions. Part A, 2012, Vol 43, Issue 10, p3442
- ISSN
1073-5623
- Publication type
Article
- DOI
10.1007/s11661-012-1329-8