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- Title
Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates.
- Authors
Kim, Young; Roh, Hee-Ra; Kim, Sungtae; Kim, Young-Ho
- Abstract
The growth kinetics of an intermetallic compound (IMC) layer formed between Sn-3.5Ag-0.5Cu (SAC) solders and Cu-Zn alloy substrates was investigated for samples aged at different temperatures. Scallop-shaped CuSn formed after soldering by dipping Cu or Cu-10 wt.%Zn wires into the molten solder at 260°C. Isothermal aging was performed at 120°C, 150°C, and 180°C for up to 2000 h. During the aging process, the morphology of CuSn changed to a planar type in both specimens. Typical bilayer of CuSn and CuSn and numerous microvoids were formed at the SAC/Cu interfaces after aging, while CuSn and microvoids were not observed at the SAC/Cu-Zn interfaces. IMC growth on the Cu substrate was controlled by volume diffusion in all conditions. In contrast, IMC growth on Cu-Zn specimens was controlled by interfacial reaction for a short aging time and volume diffusion kinetics for a long aging time. The growth rate of IMCs on Cu-Zn substrates was much slower due to the larger activation energy and the lower layer growth coefficient for the growth of Cu-Sn IMCs. This effect was more prominent at higher aging temperatures.
- Subjects
INTERMETALLIC compounds; INTERFACES (Physical sciences); SOLDER &; soldering; COPPER-zinc alloys; EFFECT of temperature on metals; CHEMICAL kinetics; KIRKENDALL effect; ACTIVATION (Chemistry)
- Publication
Journal of Electronic Materials, 2010, Vol 39, Issue 12, p2504
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-010-1379-x