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- Title
Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste.
- Authors
Zhou, Wei; Deng, WenHao; Ji, Zhihao; Ji, Xiaoliang; Ma, Liming; Lin, Pengrong; Guo, Fu
- Abstract
The accelerated application research of power electronic devices intensively stimulates the interconnect materials to catch the ability of low-temperature sintering and high-temperature service. Herein, the uniform micro/nano-hybrid structure particles, which are Ag nanoparticles decorated on the surface of Cu microparticles (Cu MPs@Ag NPs), are fabricated by a mild one-step liquid-phase reduction method. XRD and TG analysis results demonstrate Cu MPs@Ag NPs obtain better anti-oxidation than Cu MPs, which is caused by the decorated Ag NPs. Meanwhile, bare Cu-Cu bonding with Cu MPs@Ag NPs paste is achieved at 200 °C, 250 °C, and 300 °C in the air. The average strength of the Cu–Cu joint reached 29.6 MPa at 300 ℃. Additionally, it is found that the fracture mode of the Cu–Cu joint changes from brittle fracture to ductile fracture when the sintering temperatures increase. This work demonstrates the facilely synthesized micro/nano-hybrid structure particles (Cu MPs@Ag NPs) possess the potential application in high-power density electronic packaging.
- Publication
Journal of Materials Science: Materials in Electronics, 2024, Vol 35, Issue 24, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-024-13404-8