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- Title
Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass.
- Authors
Sato, Yoichiro; Imajyo, Nobuhiko; Ishikawa, Kenji; Tummala, Rao; Hori, Masaru
- Abstract
A three-dimensional (3D) glass integrated passive device (IPD) is an evolutionally advanced configuration to dramatically reduce the electronics form factor and manufacturing cost of current IPDs by introducing ultra-thin glass with through-glass-vias (TGVs). A defect-free TGV formation technology in polymer-laminated glass substrates is required to realize a highly reliable 3D glass IPD. This paper discusses mechanisms of each defect formation in the use of several types of lasers to explore suitable technology for defect-free drilling in polymer-laminated glass.
- Subjects
LASER drilling; PASSIVE components; LAMINATED glass; LASERS; ELECTRONICS
- Publication
Journal of Materials Science: Materials in Electronics, 2019, Vol 30, Issue 11, p10183
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-019-01354-5