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- Title
Structure of Dispersion-Reinforced Copper Substrate Tapes for 2G HTS.
- Authors
Degtyarenko, A. Yu.; Golovkova, E. A.; Ivanov, A. S.; Ovcharov, A. V.; Krasheninnikov, S. V.
- Abstract
Some features of the structure formation and mechanical characteristics of dispersion-reinforced copper substrate tapes have been studied during their manufacture. The change in the structure of the matrix phase and the properties of reinforcing particles dispersed in it have been investigated after col rolling and recrystallization annealing. Particular attention is paid to the possible impact of the dispersed phase on the texture of metallic substrate tapes, since the perfect texture of a tape ensures a further growth of buffer and superconducting layers on it. It is shown that alloying of the copper matrix with iron particles does not degrade the tendency to formation of a sharp cube texture.
- Subjects
IRON-copper alloys; COPPER; BUFFER layers
- Publication
Crystallography Reports, 2022, Vol 67, Issue 2, p172
- ISSN
1063-7745
- Publication type
Article
- DOI
10.1134/S1063774522020031