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- Title
Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste.
- Authors
Tamizi, M.; Movahedi, M.; Kokabi, A. H.
- Abstract
The main aim of this study is to determine the effect of dopant particles on the spreadability of composite solder paste during the reflow soldering process. Graphene NanoSheets (GNSs) without and with decorating cobalt coat (CoGNSs) were synthesized and added to Sn-0.3 wt.% Ag-0.7 wt.% Cu (SAC0307) solder paste with 0.05–0.5 weight percentage. A coupled thermo-optic system was used to evaluate the spreading behavior of composite solder pastes by real-time measurement of the paste projection angle (β) during reflow soldering from room temperature to 300 ∘ C. First, the physical and chemical phenomena of reflow soldering were investigated in three stages, i.e., ramp to soaking, soaking/preheating, and melting. Then, the β angle of the solders was measured at three constant soldering temperatures of 250, 260, and 270 ∘ C for 180 s. The agglomeration and floatation of GNSs on the outer surface of the solder cap were observed in the solder pastes containing 0.1 wt.% GNSs and higher. However, CoGNSs successfully remained in the solder bulk due to density matching and metallic bonding between the dopants and solder alloy, leading to superior spreading properties compared to the solders containing GNSs. Mechanisms of interactions between solid particles and melted flux/molten SAC solder were theoretically studied during reflow soldering from two points of view: (i) chemical bonds and intramolecular and intermolecular forces, and (ii) physical forces acting on solid particles in the melted flux and molten solder.
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 5, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-023-09921-7