Back to matchesWe found a matchYour institution may have rights to this item. Sign in to continue.TitleVacuum Packaging Technology for Uncooled Infrared Sensor.AuthorsKimata, Masafumi; Tokuda, Takayuki; Tsuchinaga, Akinobu; Matsumura, Takeshi; Abe, Hideyuki; Tokashiki, NaotakaPublicationIEEJ Transactions on Electrical & Electronic Engineering, 2010, Vol 5, Issue 2, p175ISSN1931-4973Publication typeArticleDOI10.1002/tee.20514