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- Title
Effects of Mn on the electrical resistance of electrolessly plated Ni-P thin-film and its application as embedded resistor.
- Authors
Zhou, Guoyun; Chen, Chia-Yun; Lin, Ziyin; Li, Liyi; Tao, Zhihua; He, Wei; Wong, Ching
- Abstract
The effects of manganese sulfate monohydrate (denoted as MSM) on the properties of electroless Ni-P thin-film were investigated. The properties of Ni-P thin-film were examined by means of atomic force microscopy (AFM), cyclic voltammetry, scanning electron microscopy (SEM), X-ray diffraction, energy-dispersive X-ray spectrometer and X-ray photoelectron spectroscopy. AFM and SEM results showed that MSM had significant influences on the morphology, including the formation of smaller nodules, nano-size particles boundaries on both surface and inside of nodules. Due to the specific topologies, the resistance of Ni-P thin-film deposited with MSM was increased. Based on the characterization results, we summarized that the Mn or Mn-compound were primarily confirmed to act as the stabilizer in Ni-P electroless process. Moreover, the verification test for Ni-P thin-film in application as embedded resistor was carried out through electrical, thermal stability examination by means of current-voltage (I-V), temperature coefficient of resistance and thermal shock tests, respectively. Experiment results demonstrated the Ni-P thin-film deposited with MSM is qualified for embedded resistors.
- Subjects
ELECTRIC resistance; THIN films; MANGANESE compounds; NICKEL-plating; ELECTRIC resistors; ELECTROLESS plating; ATOMIC force microscopy
- Publication
Journal of Materials Science: Materials in Electronics, 2014, Vol 25, Issue 3, p1341
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-014-1732-6