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- Title
Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.
- Authors
Yoon, Jeong-Won; Lee, Jong-Gun; Lee, Jong-Bum; Noh, Bo-In; Jung, Seung-Boo
- Abstract
In this study, electrodes on a flexible printed circuit board (FPCB) and rigid PCB (RPCB) were bonded by a thermo-compression bonding. The surface finishes on the Cu electrodes of the FPCB and RPCB were organic-solderability-preservative and electroless Ni/immersion Au (ENIG), respectively. Pb-free Sn-3.0 Ag and Sn-3.0 Ag-0.5 Cu solders were used as interlayers. In order to determine the optimum bonding conditions, such as bonding force, time, and temperature, a 90° peel test of the FPCB-RPCB joint was conducted. The relationships between the bonding conditions and peel strength were investigated. We successfully accomplished the thermo-compression bonding of reliable FPCB-RPCB joints by using Sn-Ag and Sn-Ag-Cu interlayers. The thermo-compression bonding method is a stable and well-controlled process and can produce robust and reliable connections.
- Subjects
ELECTRODES; FLEXIBLE printed circuits; COPPER electrodes; SOLDER &; soldering; BONDING of semiconductors; METAL bonding
- Publication
Journal of Materials Science: Materials in Electronics, 2012, Vol 23, Issue 1, p41
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-011-0402-1