We found a match
Your institution may have rights to this item. Sign in to continue.
- Title
Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints.
- Authors
Yaowu Shi; Jianping Liu; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li
- Abstract
In the present work, the creep strain of solder joints is measured using a stepped load creep test on a single specimen. Based on the experimental results, the constitutive model on the steady-state creep strain is established by applying a linear curve fitting for the nano-sized Ag particle-reinforced Sn37Pb based composite solder joint and the Sn37Pb solder joint, respectively. It is indicated that the activation energy of the Ag particle-reinforced Sn37Pb based composite solder joints is higher than that of Sn37Pb solder joints. It is expected that the creep resistance of the Ag particle-reinforced Sn37Pb based composite solder joints is superior to that of Sn37Pb solder.
- Subjects
SOLDER &; soldering; FILLER metal; CURVE fitting; NUMERICAL analysis; MATHEMATICAL models
- Publication
Journal of Materials Science: Materials in Electronics, 2010, Vol 21, Issue 3, p256
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-009-9902-7