Found: 22
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Label‐free diagnosis for colorectal cancer through coffee ring‐assisted surface‐enhanced Raman spectroscopy on blood serum.
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- Journal of Biophotonics, 2020, v. 13, n. 4, p. 1, doi. 10.1002/jbio.201960176
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- Article
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects.
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- Molecules, 2023, v. 28, n. 6, p. 2783, doi. 10.3390/molecules28062783
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- Article
Fabrication and characterization of nano-ZnO/CNTs/PDMS flexible pressure sensor.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 21, p. 1, doi. 10.1007/s10854-023-10966-x
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- Article
Study on copper interconnection structure of flexible electronics by Ag-PT composite membrane induced electrodeposition.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09685-6
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- Article
Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22372, doi. 10.1007/s10854-021-06723-7
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- Article
Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17143, doi. 10.1007/s10854-021-06159-z
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- Article
Mechanism of a catalytic silver(I)-complex: assisted electroless deposition of inductance coil on poly(ethylene terephthalate) film.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 11, p. 8165, doi. 10.1007/s10854-020-03289-8
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- Article
Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16226, doi. 10.1007/s10854-019-01991-w
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- Article
A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9460, doi. 10.1007/s10854-018-8979-2
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- Article
Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9186, doi. 10.1007/s10854-016-4955-x
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- Article
Effects of Mn on the electrical resistance of electrolessly plated Ni-P thin-film and its application as embedded resistor.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1341, doi. 10.1007/s10854-014-1732-6
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- Article
Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 11, p. 1980, doi. 10.1007/s10854-012-0691-z
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- Article
Erratum to: Effect of the different shapes of silver particles in conductive ink on electrical performance and microstructure of the conductive tracks.
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- 2012
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- Correction Notice
Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 108, doi. 10.1007/s10854-011-0485-8
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- Article
Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites.
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- Polymer International, 2014, v. 63, n. 3, p. 546, doi. 10.1002/pi.4556
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- Article
Three-dimensional stability evaluation of landslides and a sliding process simulation using a new geographic information systems component.
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- Environmental Geology, 2003, v. 43, n. 5, p. 503, doi. 10.1007/s00254-002-0655-3
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- Article
A Catalytic and Interfacing PEDOT:PSS/CuPc Polymerized on Cloth Fiber to Electro‐Metalize Stretchable Copper Conductive Pattern.
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- Advanced Materials Interfaces, 2022, v. 9, n. 16, p. 1, doi. 10.1002/admi.202101462
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- Article
Surface-enhanced Raman imaging through sprayed probes for the application in chemical visualization of methamphetamine within fingerprints.
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- Analytical & Bioanalytical Chemistry, 2023, v. 415, n. 19, p. 4713, doi. 10.1007/s00216-023-04757-w
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- Article
Efficacy and Safety of Transurethral Columnar Balloon Dilation of the Prostate for the Treatment of Benign Prostatic Hyperplasia: A Multicenter Trial.
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- Computational & Mathematical Methods in Medicine, 2022, p. 1, doi. 10.1155/2022/7881247
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- Article
Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture.
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- Reviews on Advanced Materials Science, 2024, v. 63, n. 1, p. 1, doi. 10.1515/rams-2023-0163
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- Article
Enhancing peel strength between liquid crystal polymer and copper with plasma treatment, surface oxidation, and silane coating.
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- Journal of Applied Polymer Science, 2022, v. 139, n. 29, p. 1, doi. 10.1002/app.52644
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- Article
Low fractal dimension modified drilling‐hole wall for PTFE high‐frequency board copper plating with plasma treatment.
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- Journal of Applied Polymer Science, 2019, v. 136, n. 42, p. N.PAG, doi. 10.1002/app.48052
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- Article