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- Title
The Future of mm-wave Packaging.
- Authors
Devlin, Liam
- Abstract
The article focuses on packaging technologies used for millimeter (mm)-wave integrated circuits (ICs) that are suitable for use on radio frequencies (RF). Topics discussed include miniaturization, surface mount technology (SMT) packaging, and quad flat no-leads package style. Other topics include ICs with integrated array antennas, wafer level chip scale packaging (WLCSP), and printed circuit board (PCB).
- Subjects
MILLIMETER wave integrated circuits; RADIO frequency; MINIATURE electronic equipment; SURFACE mount technology; QUAD flat packaging; WAFER level packaging; PRINTED circuits industry
- Publication
Microwave Journal, 2014, Vol 57, Issue 2, p24
- ISSN
0192-6225
- Publication type
Article