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- Title
Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules.
- Authors
Zhang, S.; Zhu, N.; Liu, Y.; Xie, L.
- Abstract
Scattering parameters of photodiode chip, TO header and TO packaged module are measured, and the effects of TO packaging network on the high-frequency response of photodiode are investigated. Based on the analysis, the potential bandwidth of TO packaging techniques is estimated from the scattering parameters of the TO packaging network. Another method for estimating the potential bandwidth from the equivalent circuit for the TO packaged photodiode model is also presented. The results obtained using both methods show that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of 22 GHz.
- Subjects
PHOTODIODES; PACKAGING; SCATTERING (Physics); FREQUENCY spectra; BANDWIDTHS; DIGITAL electronics; ELECTRONIC systems
- Publication
Optical & Quantum Electronics, 2006, Vol 38, Issue 8, p675
- ISSN
0306-8919
- Publication type
Article
- DOI
10.1007/s11082-006-9004-1