We found a match
Your institution may have rights to this item. Sign in to continue.
- Title
Interfacial microstructure and properties of diamond/Cu- xCr composites for electronic packaging applications.
- Authors
Zhang, Ximin; Guo, Hong; Yin, Fazhang; Fan, Yeming; Zhang, Yongzhong
- Abstract
Diamond/Cu- xCr composites were fabricated by pressure infiltration process. The thermal conductivities of diamond/Cu- xCr ( x = 0.1, 0.5, 0.8) composites were above 650 W/mK, higher than that of diamond/Cu composites. The tensile strengths ranged from 186 to 225 MPa, and the bonding strengths ranged from 400 to 525 MPa. Influences of Cr element on the thermo-physical properties and interface structures were analyzed. The intermediate layer was confirmed as CrC and the amount of CrC increased with the increase of Cr concentration in Cu- xCr alloys. When the Cr concentration was up to 0.5 wt.%, the content of the CrC layer was constant. As the thickness of the CrC layer became larger, the composites showed a lower thermal conductivity but higher mechanical properties. The coefficients of thermal expansion (CTE) of diamond/Cu- xCr ( x = 0.1, 0.5, 0.8) composites were in good agreement with the predictions of the Kerner' model.
- Publication
Rare Metals, 2011, Vol 30, Issue 1, p94
- ISSN
1001-0521
- Publication type
Article
- DOI
10.1007/s12598-011-0204-x