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- Title
Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.
- Authors
Zhang, Liang; Sun, Lei; Han, Ji-guang; Guo, Yong-huan
- Abstract
The relationship between Ce content/CeSn sizes and the whiskers growth is newly reported systematically. The whiskers growth can be observed in the surface of bulk CeSn particles, the rate of whisker growth was significantly slowed with Ce content lower than 0.1 wt%. At higher concentration of Ce, whisker growth rate becomes higher and noticeable. It is thought that the higher Ce chemical potential for oxidation provides a path for the mechanism of whisker growth. With all the other benefits of Ce addition, the potential to promote whisker growth indicate that only dilute concentration of Ce can be tolerated in SnAgCu alloys without whiskering effect. The results demonstrated that the trace amount of Ce can be utilized as additive into SnAgCu solder in microelectronic industry.
- Subjects
CERIUM compounds; CRYSTAL whiskers; ELECTRONIC packaging; MICROELECTRONIC materials; MICROELECTRONICS research
- Publication
Journal of Materials Science: Materials in Electronics, 2015, Vol 26, Issue 8, p6194
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-015-3202-1