Back to matchesWe found a matchYour institution may have rights to this item. Sign in to continue.TitleElectrostatic–Mechanical Synergistic In Situ Multiscale Tissue Adhesion for Sustainable Residue‐Free Bioelectronics Interfaces.AuthorsKim, Da Wan; Song, Kang‐Il; Seong, Duhwan; Lee, Yeon Soo; Baik, Sangyul; Song, Jin Ho; Lee, Heon Joon; Son, Donghee; Pang, ChanghyunPublicationAdvanced Materials, 2022, Vol 34, Issue 5, p1ISSN0935-9648Publication typeArticleDOI10.1002/adma.202105338