Back to matchesWe found a matchYour institution may have rights to this item. Sign in to continue.TitleEffect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging.AuthorsZhang, K K; Li, C Y; Qiu, R F; Shi, H X; Wang, Y LPublicationMaterials Science & Technology, 2012, Vol 28, Issue 6, p760ISSN0267-0836Publication typeArticleDOI10.1179/1743284711Y.0000000131