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- Title
Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders.
- Authors
Liu, Chen; Peng, Jubo; Hu, Juntao; Cai, Shanshan; Wang, Xiaojing
- Abstract
In this paper, the oxidation resistance of SCN (Sn–0.7Cu–0.05Ni), SCP (Sn–0.7Cu doped by 0.02 wt% P), and SCNPG solder alloys (Sn–0.7Cu with 0.007 wt% Ge and 0.005 wt% P addition) were investigated at 260 °C in air. Their oxidized surfaces were systematically studied by XPS and SEM-EDS analysis. The results show that SCNPG alloys have better oxidation resistance compared to SCP alloys with more antioxidant additions before oxidation. This may be due to the combined weight of P and Ge in SCNPG alloy surface is higher than that of P alone in SCP alloy after oxidation. Furthermore, for the oxidized surface, P2O5 and GeO2 formed in the outer layer and CuP2 and FeP exist in subsurface layer. Formation of these oxides and P compounds can be attributed to that Gibbs free energy of oxides is lower than that of P compounds, meaning that oxides are easier to form than P compounds. After the formation of P2O5, the excess P forms compounds with negative enthalpy change.
- Subjects
LEAD-free solder; TIN alloys; GIBBS' free energy; SOLDER &; soldering; GERMANIUM; OXIDATION
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 1, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-022-09445-6