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Using Personalized Data Tasks in College Algebra.
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- MathAMATYC Educator, 2021, v. 12, n. 3, p. 4
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- Article
A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 109, doi. 10.1007/s11664-011-1759-x
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- Article
Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 324, doi. 10.1007/s11664-010-1460-5
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- Article
A study on the formation mechanism of ytterbium silicide for Schottky contact applications.
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- Surface & Interface Analysis: SIA, 2012, v. 44, n. 11/12, p. 1497, doi. 10.1002/sia.4985
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- Article
Two genes involved in clindamycin resistance of Bacillus licheniformis and Bacillus paralicheniformis identified by comparative genomic analysis.
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- PLoS ONE, 2020, v. 15, n. 4, p. 1, doi. 10.1371/journal.pone.0231274
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- Article
대동맥궁에서 독립적으로 기시하는 왼쪽 속목동맥, 왼쪽 바깥목동맥 및 왼쪽 척추동맥의 복합변이: 증례 보고
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- Journal of the Korean Society of Radiology (2951-0805), 2023, v. 84, n. 1, p. 286, doi. 10.3348/jksr.2022.0065
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- Article
A Post-Treatment Method to Enhance the Property of Aerosol Jet Printed Electric Circuit on 3D Printed Substrate.
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- Materials (1996-1944), 2020, v. 13, n. 24, p. 5602, doi. 10.3390/ma13245602
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- Article
Nanoscale Dewetting: Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020).
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- Advanced Materials, 2020, v. 32, n. 21, p. 1, doi. 10.1002/adma.202070161
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- Article
Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing.
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- Advanced Materials, 2020, v. 32, n. 21, p. 1, doi. 10.1002/adma.201908422
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- Article
Diagonals of injective tensor products of Banach lattices with bases.
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- Positivity, 2017, v. 21, n. 3, p. 975, doi. 10.1007/s11117-016-0447-8
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- Article
Laser-Induced Graphene on Additive Manufacturing Parts.
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- Nanomaterials (2079-4991), 2019, v. 9, n. 1, p. 90, doi. 10.3390/nano9010090
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- Article