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- Title
Electrochemical properties of copper and gold containing dental amalgams.
- Authors
Sarkar, N. K.; Greener, E. H.
- Abstract
Alloying or admixing of a dental amalgam alloy with an element or alloy which has a higher affinity for tin oilers a means for eliminating the corrosion prone γ2 phase. Accordingly, the corrosion behaviour of non-conventional amalgams containing Cu and Au were investigated by anodic polarization studies in Ringer's solution. The Cu containing amalgams were produced by admixing Cu-Hg (copper amalgam) with conventional amalgam in the ratios of 0.5 : 1 and 1 : 1. A 10 w/o Au in Ag3Sn was used as the gold amalgam alloy. The anodic polarization profile of the 0.5 : 1 Cu admixed was similar in shape to conventional amalgams although current densities were less. After ageing for 1 month the - 250 mV peak associated with γ2 disappeared and the current density decreased by ten fold. After 2 months the current density decreased by one hundred fold. The anodic polarization of the 1 : 1 Cu admixed amalgams did not display the -250 mV (γ2) peak after 1 week and current densities were 103 below that of conventional amalgams. The behaviour of these interesting amalgams is rationalized on the basis of the ease of formation of Cu Sn intermetallics where Cu/Sn ⩾ 3. The anodic polarization profile of 10 w/o Au containing amalgam essentially is that of conventional amalgam and does not change drastically after 6 months. Although the Au may reduce or eliminate the γ2 phase the resulting AuSn4 apparently corrodes in an analogous fashion. However, since distribution of AuSn4 may be different from γ2, i.e. not continuous, the effect of corrosion on its mechanical properties may be different.
- Subjects
DENTAL amalgams; DENTAL metallurgy; DENTAL materials; COPPER; GOLD; ELECTROCHEMISTRY
- Publication
Journal of Oral Rehabilitation, 1975, Vol 2, Issue 2, p157
- ISSN
0305-182X
- Publication type
Article
- DOI
10.1111/j.1365-2842.1975.tb01526.x