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- Title
Intermetallic growth study at Sn-3.0Ag-0.5Cu/Cu solder joint interface during different thermal conditions.
- Authors
Li, Shuai; Yan, Yan-fu
- Abstract
The morphology and growth behaviors of intermetallic compounds (IMCs) of Sn-3.0Ag-0.5Cu/Cu solder joints were investigated during isothermal aging, thermal cycling and thermal shock. The Sn-3.0Ag-0.5Cu/Cu solder joints were isothermal aged at 150 °C, while the non-isothermal aging was performed within the temperature range from −40 to +150 °C. It was observed that the CuSn layer initially formed between the copper substrate and solder, followed by the creation of a CuSn layer for aging times greater than 200 h or 200 thermal cycles. However, the CuSn could not be found in solder joints until thermal shock 800 cycles. The results showed that the initial scallop-like IMCs layer changed into a level duplex structure with the aging time (cycling numbers) increasing. The growth rate of CuSn was lower than that of CuSn during isothermal aging. While for thermal cycling, it was CuSn contributed more to the growth of IMCs than the CuSn. The value of the time exponent n under isothermal aging, thermal cycling and thermal shock were about 0.58, 0.64, 0.66 respectively.
- Subjects
SOLDER joints; THERMOCYCLING; THERMAL shock; THERMAL conductivity; INTERMETALLIC compounds; MECHANICAL properties of condensed matter
- Publication
Journal of Materials Science: Materials in Electronics, 2015, Vol 26, Issue 12, p9470
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-015-3406-4