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- Title
Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding.
- Authors
Tian, Yanhong; Hang, Chunjin; Zhao, Xin; Liu, Baolei; Wang, Ning; Wang, Chunqing
- Abstract
In this paper, microstructure evolution and phase transformation of Cu-In intermetallic compounds in Cu/In/Cu joints formed by solid-liquid interdiffusion bonding at 260 and 360 °C were investigated respectively. The shearing properties and fracture behaviors of the Cu/In/Cu joints formed under different bonding conditions were also studied. For Cu/In/Cu joints bonded at 260 °C, CuIn phase firstly generated and then CuIn phase formed between CuIn layer and Cu substrate. For Cu/In/Cu joints bonded at 360 °C, CuIn phase firstly formed and then parts of CuIn grains transformed to CuIn phase, and this transition from incomplete to complete coverage of CuIn/CuIn grain boundaries by CuIn phases was observed with the bonding time increasing. The shear test results show that CuIn was high-quality phase which could improve the mechanical properties of Cu/In/Cu joints. After shear test, the fractures in Cu/In/Cu joints bonded at 260 °C were found at CuIn layers and the fracture mode was cleavage fracture. In the case of the joints bonded at 360 °C, the intergranular fractures were found at the interface between CuIn layer and CuIn layer while the cleavage fractures were found at CuIn layer.
- Subjects
PHASE transitions; INTERMETALLIC compounds synthesis; COPPER compounds synthesis; SOLID-liquid transformations
- Publication
Journal of Materials Science: Materials in Electronics, 2014, Vol 25, Issue 9, p4170
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-014-2145-2