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- Title
Strengthening mechanism of nano-AlO particles reinforced Sn3.5Ag0.5Cu lead-free solder.
- Authors
Chuang, T. H.; Wu, M. W.; Chang, S. Y.; Ping, S. F.; Tsao, L. C.
- Abstract
To improve the properties of the eutectic Sn3.5Ag0.5Cu lead-free solder, various amounts of mixed nano-AlO particles were added. The microstructure, thermal analysis, density, thermal expansion coefficient (CTE), and mechanical behavior were studied. The results of differential scanning calorimetry (DSC) indicate that the melting point of the composite solder doped with nano-AlO particles is slightly higher that of the Sn3.5Ag0.5Cu lead-free solder and has a eutectic peak. The Sn3.5Ag0.5Cu composite solders exhibited lower density values and thermal expansion coefficient (CTE) values than did the unreinforced solder matrix. Compared to solder without the addition of nano-AlO particles, the formation of dendritic β-Sn grains, the AgSn phase average size, and the spacing of lamellae decreased significantly in the composite solder matrix. The mechanical properties also improved with increasing weight percentages of nano-AlO particles. However, the ductility of the Sn3.5Ag0.5Cu composite solder decreased. For the addition of 1 wt% nano-AlO particles, microporosity was observed both at and along the grain boundary regions, coupled with the presence of second-phase particles (i.e. nano-AlO and AgSn).
- Subjects
STRENGTHENING mechanisms in solids; NANOPARTICLES; SOLDER &; soldering; MICROSTRUCTURE; THERMAL analysis; THERMAL expansion; CALORIMETRY
- Publication
Journal of Materials Science: Materials in Electronics, 2011, Vol 22, Issue 8, p1021
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-010-0253-1