Found: 102
Select item for more details and to access through your institution.
In vitro and in vivo antifungal activities of T-2307, a novel arylamidine, against Cryptococcus gattii: an emerging fungal pathogen.
- Published in:
- 2017
- By:
- Publication type:
- journal article
T-2307, a novel arylamidine, is transported into Candida albicans by a high-affinity spermine and spermidine carrier regulated by Agp2.
- Published in:
- 2016
- By:
- Publication type:
- journal article
Effect of Various Parameters on the Shear Strength of Solid-State Nanoporous Cu Bonding in Cu–Cu Disks for Power Device Packaging.
- Published in:
- Journal of Electronic Materials, 2022, v. 51, n. 7, p. 3851, doi. 10.1007/s11664-022-09634-3
- By:
- Publication type:
- Article
Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 3, p. 2151, doi. 10.1007/s11664-019-07916-x
- By:
- Publication type:
- Article
Brazing Graphite to Aluminum Nitride for Thermal Dissipation Purpose.
- Published in:
- Advanced Engineering Materials, 2017, v. 19, n. 7, p. n/a, doi. 10.1002/adem.201600876
- By:
- Publication type:
- Article
1- 0-Hexyl-2,3,5-trimethylhydroquinone inhibits IκB phosphorylation and degradation-linked inducible nitric oxide synthase expression: beyond antioxidant function.
- Published in:
- Journal of Pharmacy & Pharmacology, 2002, v. 54, n. 3, p. 383, doi. 10.1211/0022357021778628
- By:
- Publication type:
- Article
Uptake of T-2307, a novel arylamidine, in Candida albicans.
- Published in:
- Journal of Antimicrobial Chemotherapy (JAC), 2010, v. 65, n. 8, p. 1681, doi. 10.1093/jac/dkq177
- By:
- Publication type:
- Article
Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation.
- Published in:
- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-17119-w
- By:
- Publication type:
- Article
Mutational analysis of FOXL2 p. C134W and expression of bone morphogenetic protein 2 in Japanese patients with granulosa cell tumor of ovary.
- Published in:
- Journal of Obstetrics & Gynaecology Research, 2014, v. 40, n. 5, p. 1197, doi. 10.1111/jog.12324
- By:
- Publication type:
- Article
Protective Effects of Cold Ringer's Solution Perfusion in Abdominal Aortic Surgery Requiring Renal Artery Clamp.
- Published in:
- In Vivo, 2020, v. 34, n. 2, p. 739, doi. 10.21873/invivo.11833
- By:
- Publication type:
- Article
ERF‐related craniosynostosis: The phenotypic and developmental profile of a new craniosynostosis syndrome.
- Published in:
- American Journal of Medical Genetics. Part A, 2019, v. 179, n. 4, p. 615, doi. 10.1002/ajmg.a.61073
- By:
- Publication type:
- Article
Experimental Protection of Mice against Lethal Staphylococcus aureus Infection by Novel Bacteriophage øMR11.
- Published in:
- Journal of Infectious Diseases, 2003, v. 187, n. 4, p. 613, doi. 10.1086/374001
- By:
- Publication type:
- Article
γ-Radiolysis of 5-fluorouracil and 5-fluorouridine derivatives having sulfur-containing substituents.
- Published in:
- Journal of Heterocyclic Chemistry, 1994, v. 31, n. 2, p. 335, doi. 10.1002/jhet.5570310213
- By:
- Publication type:
- Article
Synthesis and biological activity of novel mitomycin C analogs derived from mitomycin A.
- Published in:
- Journal of Heterocyclic Chemistry, 1994, v. 31, n. 1, p. 113, doi. 10.1002/jhet.5570310120
- By:
- Publication type:
- Article
Synthesis and γ-radiolysis of 2′-deoxy-5-fluorouridine and 5-fluorouridine derivatives.
- Published in:
- Journal of Heterocyclic Chemistry, 1992, v. 29, n. 5, p. 1133, doi. 10.1002/jhet.5570290516
- By:
- Publication type:
- Article
Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation-Reduction Bonding with Copper Microparticles.
- Published in:
- Journal of Electronic Materials, 2019, v. 48, n. 4, p. 2263, doi. 10.1007/s11664-019-07046-4
- By:
- Publication type:
- Article
Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O<sub>3</sub> Treatment.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 10, p. 5952, doi. 10.1007/s11664-018-6462-8
- By:
- Publication type:
- Article
Effects of In and Ni Addition on Microstructure of Sn-58Bi Solder Joint.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4158, doi. 10.1007/s11664-014-3359-z
- By:
- Publication type:
- Article
Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 6, p. 1260, doi. 10.1007/s11664-013-2583-2
- By:
- Publication type:
- Article
Surfactant-Free Synthesis of Copper Particles for Electrically Conductive Adhesive Applications.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2527, doi. 10.1007/s11664-012-2102-x
- By:
- Publication type:
- Article
High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 10, p. 2274, doi. 10.1007/s11664-010-1326-x
- By:
- Publication type:
- Article
Improvement of High-Temperature Performance of Zn-Sn Solder Joint.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 8, p. 1241, doi. 10.1007/s11664-010-1233-1
- By:
- Publication type:
- Article
Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 1, p. 115, doi. 10.1007/s11664-009-0946-5
- By:
- Publication type:
- Article
Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2610, doi. 10.1007/s11664-009-0921-1
- By:
- Publication type:
- Article
Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates.
- Published in:
- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 45, doi. 10.1007/s11664-007-0234-1
- By:
- Publication type:
- Article
Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 12, p. 1630, doi. 10.1007/s11664-007-0243-0
- By:
- Publication type:
- Article
Morphology and Pull Strength of Sn-Ag(-Co) Solder Joint with Copper Pad.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1137, doi. 10.1007/s11664-007-0148-y
- By:
- Publication type:
- Article
Morphology and Growth Pattern Transition of Intermetallic Compounds between Cu and Sn-3.5Ag Containing a Small Amount of Additives.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2081, doi. 10.1007/s11664-006-0317-4
- By:
- Publication type:
- Article
Interfacial Reaction between Sn-0.7Cu (-Ni) Solder and Cu Substrate.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1127, doi. 10.1007/BF02692576
- By:
- Publication type:
- Article
Posterior Calvarial Distraction in older paediatric population: single centre paediatric neurosurgery craniofacial unit outcomes.
- Published in:
- Child's Nervous System, 2022, v. 38, n. 7, p. 1341, doi. 10.1007/s00381-022-05524-5
- By:
- Publication type:
- Article
Supratentorial vs infratentorial posterior calvarial distraction osteogenesis for the increase of ICV in children with syndromic or multi-suture craniosynostosis: a retrospective cohort study.
- Published in:
- Child's Nervous System, 2021, v. 37, n. 5, p. 1677, doi. 10.1007/s00381-021-05064-4
- By:
- Publication type:
- Article
Amelioration of Chiari type 1 malformation and syringomyelia following posterior calvarial distraction in Crouzon's syndrome-a case report.
- Published in:
- Child's Nervous System, 2014, v. 30, n. 1, p. 177, doi. 10.1007/s00381-013-2202-9
- By:
- Publication type:
- Article
Calvarial remodelling for sagittal synostosis: does fibrin glue (Tisseel™) reduce post-operative blood transfusion requirements?
- Published in:
- Child's Nervous System, 2009, v. 25, n. 7, p. 867, doi. 10.1007/s00381-009-0851-5
- By:
- Publication type:
- Article
Posterior calvarial vault expansion using distraction osteogenesis.
- Published in:
- Child's Nervous System, 2009, v. 25, n. 2, p. 231, doi. 10.1007/s00381-008-0758-6
- By:
- Publication type:
- Article
Effects of 1-O-hexyl-2,3,5-trimethylhydroquinone on carbon tetrachloride-induced hepatic cirrhosis in rats.
- Published in:
- Hepatology Research, 2010, v. 40, n. 6, p. 566, doi. 10.1111/j.1872-034X.2010.00638.x
- By:
- Publication type:
- Article
Synthesis of Hierarchical Structured CuSn Alloy Mesoparticles and Its Application of Cu-Cu Joint Materials.
- Published in:
- Materials Transactions, 2022, v. 63, n. 6, p. 794, doi. 10.2320/matertrans.MT-MC2022008
- By:
- Publication type:
- Article
Adhesion Mechanism between Mold Resin and Sputtered Stainless Steel Ground Films for Electromagnetic Wave Shield Packages.
- Published in:
- Materials Transactions, 2022, v. 63, n. 6, p. 766, doi. 10.2320/matertrans.MT-MC2022001
- By:
- Publication type:
- Article
Bilateral coronary ostial atresia in a patient with pulmonary atresia and ventricular septal defect.
- Published in:
- 2021
- By:
- Publication type:
- journal article
Coronary-pulmonary arterial fistula with anomalous origin and aneurysms of the coronary arteries.
- Published in:
- European Journal of Cardio-Thoracic Surgery, 2022, v. 62, n. 1, p. 1, doi. 10.1093/ejcts/ezab561
- By:
- Publication type:
- Article
Sintering of the Mechanochemically Activated Powders of Hexagonal Boron Nitride.
- Published in:
- Journal of the American Ceramic Society, 1989, v. 72, n. 8, p. 1482, doi. 10.1111/j.1151-2916.1989.tb07682.x
- By:
- Publication type:
- Article
Thermal decomposition temperature-dependent bonding performance of Ag nanostructures derived from metal–organic decomposition.
- Published in:
- Journal of Materials Science, 2024, v. 59, n. 40, p. 19038, doi. 10.1007/s10853-024-10250-1
- By:
- Publication type:
- Article
Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition.
- Published in:
- Journal of Materials Science, 2021, v. 56, n. 16, p. 9769, doi. 10.1007/s10853-021-05862-w
- By:
- Publication type:
- Article
Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy.
- Published in:
- Journal of Materials Science, 2020, v. 55, n. 24, p. 10824, doi. 10.1007/s10853-020-04691-7
- By:
- Publication type:
- Article
Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere.
- Published in:
- Journal of Materials Science, 2020, v. 55, n. 7, p. 3107, doi. 10.1007/s10853-019-04153-9
- By:
- Publication type:
- Article
Isolation and Characterization of Facultative-Anaerobic Antimonate-Reducing Bacteria.
- Published in:
- Microorganisms, 2020, v. 8, n. 9, p. 1435, doi. 10.3390/microorganisms8091435
- By:
- Publication type:
- Article
Suppressed Growth of (Fe, Cr<sub>,</sub> Co<sub>,</sub> Ni<sub>,</sub> Cu)Sn<sub>2</sub> Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu<sub>0.5</sub> Substrate during Solid-state Aging.
- Published in:
- Scientific Reports, 2019, v. 9, n. 1, p. N.PAG, doi. 10.1038/s41598-019-46757-w
- By:
- Publication type:
- Article
Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints.
- Published in:
- Metals (2075-4701), 2022, v. 12, n. 1, p. 33, doi. 10.3390/met12010033
- By:
- Publication type:
- Article
Effects of In Content on the Microstructure and Mechanical Properties of In–Bi Alloys During Isothermal Aging.
- Published in:
- Metals (2075-4701), 2019, v. 9, n. 5, p. 548, doi. 10.3390/met9050548
- By:
- Publication type:
- Article
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition.
- Published in:
- Metals (2075-4701), 2018, v. 8, n. 8, p. 586, doi. 10.3390/met8080586
- By:
- Publication type:
- Article
Analysis of genetic variation and phylogeny of the predatory bug, Pilophorus typicus, in Japan using mitochondrial gene sequences.
- Published in:
- Journal of Insect Science, 2011, v. 11, p. 1, doi. 10.1673/031.011.0118
- By:
- Publication type:
- Article