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- Title
ISTFA 2023 SYSTEM IN PACKAGE (SIP) USER GROUP.
- Authors
Yan Li; Tracy, Bryan; Wentao Qin
- Abstract
The article discusses the adoption of a new panel discussion format by the System in Package (SIP) User Group for International Symposium for Testing and Failure Analysis 2023, focusing on the topic "Overcome the Challenges in SIP FA." Topics also included challenges like finding the root cause with limited failing samples and logistic/legal issues in SIP FA, such as ownership agreements and cooperation standards among multiple suppliers.
- Subjects
PARTICIPATION
- Publication
Electronic Device Failure Analysis, 2024, Vol 26, Issue 1, p42
- ISSN
1537-0755
- Publication type
Article