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- Title
Self-reducing copper paste with high conductivity and oxidation resistance for flexible substrate by intensive pulsed light sintering.
- Authors
Lu, Ruihan; Hao, Wuchang; Kong, Long; Zhao, Keliang; Bai, Hao; Lei, Lijun; Liu, Zhenguo
- Abstract
The low-temperature curing silver paste has been widely used as one of the flexible electronic pastes. However, its high cost turns attention to the flexible paste with copper as the conductive phase. Herein, a flexible copper paste was prepared by intense pulsed light (IPL) sintering technology combined with a new low-cost organic carrier system and modified copper powder. Using the photothermal decomposition of modifier to reduce copper oxide with reducing groups, while the remaining groups are coated on the surface of copper powder to protect the copper powder from oxidation, we not only solved the problem of oxidation of flexible copper paste but also ensured the low cost of flexible copper paste. The optimum parameters for IPL sintering rely on conditions of the ODA concentration of the modified copper powder (10 wt%), the sintering voltage (1600 V), the sintering time (1900 μs), and the flashing times (2). The resistance change rate after standing in air is less than 5%. This work provides a realistic reference for the preparation and application of flexible copper pastes.
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 5, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-023-09834-5