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- Title
Frequency Bandwidth Estimation of TO Packaging Techniques for Laser Modules.
- Authors
Zhu, N. H.; Wang, Y. L.; Qian, C.; Pun, E. Y. B.; Chung, P. S.
- Abstract
Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.
- Subjects
LASERS; LIGHT amplifiers; OPTOELECTRONIC devices; OPTICAL instruments; ELECTRONICS; ELECTROOPTICS
- Publication
Optical & Quantum Electronics, 2005, Vol 37, Issue 10, p903
- ISSN
0306-8919
- Publication type
Article
- DOI
10.1007/s11082-004-8307-3