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- Title
Fabrication and measurement of 3D LPF based on coaxial TSV.
- Authors
Fengjuan Wang; He Li; Ningmei Yu
- Abstract
The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon via (TSV) offers a possible solution to this issue by developing 3D LPF architecture. A 3D LPF based on coaxial TSV is exploited by fabrication and measurement. The measurement result shows good agreement with that obtained by finite element method.
- Subjects
LOWPASS electric filters; COMPLEMENTARY metal oxide semiconductors; THROUGH-silicon via; THREE-dimensional printing; FINITE element method
- Publication
Electronics Letters (Wiley-Blackwell), 2019, Vol 55, Issue 2, p102
- ISSN
0013-5194
- Publication type
Article
- DOI
10.1049/el.2018.7325