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- Title
Subsurface deformation of machined Al<sub>2</sub>O<sub>3</sub> andAl<sub>2</sub>O<sub>3</sub>/5vol%SiC nanocomposite.
- Authors
Wu, H.; Inkson, B. J.; Roberts, S. G.
- Abstract
Under machine grinding, material removal in monolithic Al[sub 2]O[sub 3] is by intergranular fracture and grain pull-out. In comparison, under the same grinding conditions, an Al[sub 2]O[sub 3]/ 5%SiC nanocomposite undergoes significant surface grooving and intragranular fracture. The subsurface deformation mechanisms were investigated by cross-sectional transmission electron microscopy. For Al[sub 2]O[sub 3], the residual deformation zone was localized very close to the surface in the first layer of grains, with dislocations occurring only within 1.5 µm of the top surface and a high density of basal twins penetrating to a depth of one single grain. Cracks were present along grain boundaries or basal twin interfaces. For Al[sub 2]O[sub 3]/SiC nanocomposites, the main residual plastic deformation is observed to be dislocations activated to a depth of about 10 µm (approx. 3–4 grains), with twinning rarely observed. Possible mechanisms by which the SiC particles influence the subsurface deformation and material removal modes are discussed.
- Subjects
DEFORMATIONS (Mechanics); NANOSTRUCTURED materials; COMPOSITE materials
- Publication
Journal of Microscopy, 2001, Vol 201, Issue 2, p212
- ISSN
0022-2720
- Publication type
Article
- DOI
10.1046/j.1365-2818.2001.00768.x