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- Title
PLATING OF COPPER LAYERS ON POLYIMIDES USING ELECTROLESS PLATING BY SURFACE MODIFICATION.
- Authors
JI, EUN SUN; KIM, YOUNG HWAN; KANG, YONG CHEOL; KANG, YOUNG SOO; AHN, BYUNG HYUN
- Abstract
This work describes electroless deposition of copper layers onto a polyimide (PI) film. The film was modified by etching with 1.0 M KOH solution treatment, and an activated Ag thin film was developed on this surface using 0.1 M AgNO3. The Cu layers were coated on the activated surface of polyimide films by electroless plating method. The thickness and surface morphology of Cu layers on the PI films were characterized with atomic force microscopy. The surface properties of PI film were identified with contact angle measurements.
- Subjects
COPPER; POLYIMIDES; THIN films; SURFACE chemistry; PHYSICAL &; theoretical chemistry
- Publication
Surface Review & Letters, 2007, Vol 14, Issue 4, p593
- ISSN
0218-625X
- Publication type
Article
- DOI
10.1142/S0218625X07009724