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- Title
Construction and Electrochemical Property Studies of DNA Duplexes Tethered to Gold Electrode via Au−C Bond.
- Authors
Zhang, Meng; Chen, Jia; Pi, Xiaomei; Deng, Chunyan; Xiang, Juan
- Abstract
Effective linkage of DNA onto metal surfaces plays a crucial role in the applications of DNA as electrochemical recognition, signal output and amplification devices for gene and protein detections, specific analyte recognitions, catalysis, and so on. Here we report a promising and operationally simple approach for the construction of double‐stranded DNA‐linked Au interface via Au−C bond (RdsDNA‐C−Au), upon efficient in situ cleavage of trimethylsilyl end group of 4‐[(trimethylsilyl) ethynyl] benzoic acid and subsequent dehydration condensation between NH2‐modified DNA and benzoic acid. Due to the introduction of large conjugated π group (4‐carboxyphenylethynyl) as the "bridge bond", the conductivity of the RdsDNA‐C−Au interface is greatly improved. As a result, under commonly used DNA packing density (>0.5 pmol cm−2), the surface‐confined electron transfer at the interface is simply mediated by the stacked‐bases of dsDNA, independent of the orientation of dsDNA (tethered to the electrode at 5′‐ or 3′‐end). Also, compared to the traditional RdsDNA‐S−Au interface via alkanethiol linker, the RdsDNA‐C−Au interface displays more sensitive electrochemical response and excellent stability. Due to the better stability, conductivity and simple electron transfer mechanism, the RdsDNA‐C−Au interface is anticipated to be widely used in electrochemistry‐involved molecular recognitions, gene and protein detections with higher sensitivity and accuracy.
- Subjects
DNA; GOLD electrodes
- Publication
Electroanalysis, 2019, Vol 31, Issue 3, p477
- ISSN
1040-0397
- Publication type
Article
- DOI
10.1002/elan.201800673