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- Title
NUMERICAL SIMULATION AND EXPERIMENT OF LAMINAR HEAT TRANSFER CHARACTERISTICS IN MICRO-CHANNEL COLLECTOR.
- Authors
Ruichen BAI; TORII, S.
- Abstract
In response to the problems of high mass and high thermal resistance in traditional cold plate collectors, the author proposes a shaped and efficient micro-channel collector structure design for non-normal temperature control scenarios such as high power, multiple heat sources, and highly non-uniform power density. The author conducted numerical and experimental studies on the laminar heat transfer in a highly efficient micro-channel shaped collector for non-normal temperature control scenarios such as high power, multiple heat sources, and highly non-uniform power density, the results show that: The relative deviation between the simulated and experimental values of the pressure drop of the micro-channel collector using perfluorotriethylamine as the working fluid is within -20%, and the relative deviation between the simulated and experimental values of the surface temperature is within +3 ° C, the predicted trend of the pressure drop and temperature field of the collector is in good agreement with the experimental values, indicating the feasibility of using numerical simulation methods for performance analysis and design optimization of 3-D printed micro-channel collectors. As the flow rate increases, the pressure drop of the collector increases approximately linearly, while the value increase of the total heat transfer coefficient gradually decreases, and increasing inlet temperature or heating power will reduce pressure drop of collector and increase total heat transfer coefficient. The influence of gravity on the pressure drop and total heat transfer coefficient of micro-channel collectors is less than 1. The straight through micro-channel collector has lower pressure drop and stronger heat transfer ability compared to the folded type collector.
- Subjects
HEAT transfer; HEAT transfer coefficient; THERMAL resistance; HEAT pipes; PRESSURE drop (Fluid dynamics); ENTHALPY; COMPUTER simulation; HEAT release rates
- Publication
Thermal Science, 2024, Vol 28, Issue 2B, p1281
- ISSN
0354-9836
- Publication type
Article
- DOI
10.2298/TSCI2402281B