Found: 15
Select item for more details and to access through your institution.
Combined process for treatment of HEDP copper electroplating wastewater.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 400, doi. 10.19289/j.1004-227x.2021.05.015
- By:
- Publication type:
- Article
Preparation and photocatalytic activity of flexible Ag@TiO<sub>2</sub>/carbon nanofiber membrane.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 393, doi. 10.19289/j.1004-227x.2021.05.014
- By:
- Publication type:
- Article
Advances in pretreatment processes for metallization on special polymer materials.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 385, doi. 10.19289/j.1004-227x.2021.05.013
- By:
- Publication type:
- Article
Effect of coating structure on color of rolled copper foil.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 352, doi. 10.19289/j.1004-227x.2021.05.007
- By:
- Publication type:
- Article
Process of hot coloring for applying finishes imitative of marble to copper products.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 377, doi. 10.19289/j.1004-227x.2021.05.011
- By:
- Publication type:
- Article
Study on initial corrosion mechanism of tin-free steel surface.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 369, doi. 10.19289/j.1004-227x.2021.05.010
- By:
- Publication type:
- Article
Protective effect of self-assembled alkyithiol monolayers on electrolessly silver-plated Keviar® fabrics.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 362, doi. 10.19289/j.1004-227x.2021.05.009
- By:
- Publication type:
- Article
Research progress of electroplating process for 3D package TSV copper interconnect.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 358, doi. 10.19289/j.1004-227x.2021.05.008
- By:
- Publication type:
- Article
Optimization of galvanostatic micro-arc oxidation on eutectic Al-Si alloy.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 380, doi. 10.19289/j.1004-227x.2021.05.012
- By:
- Publication type:
- Article
Numerical simulation and experimental study on electrodeposition of copper foil with through holes.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 343, doi. 10.19289/j.1004-227x.2021.05.006
- By:
- Publication type:
- Article
Effect of the composition of flux on properties of hot-dip Al-x%Si-0.5%RE coating on 304 stainless steel.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 339, doi. 10.19289/j.1004-227x.2021.05.005
- By:
- Publication type:
- Article
Comparison in properties of tinplates produced by PSA and MSA processes after being stored for three years.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 335, doi. 10.19289/j.1004-227x.2021.05.004
- By:
- Publication type:
- Article
Failure analysis and control of electroplating on multilayer ceramic capacitor.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 332, doi. 10.19289/j.1004-227x.2021.05.003
- By:
- Publication type:
- Article
Effect of sodium A,A-dimethyl-dithiocarbamyl-propanesulfonate on electroless copper plating in tetrahydroxypropyl ethylenediamine bath.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 323, doi. 10.19289/j.1004-227x.2021.05.001
- By:
- Publication type:
- Article
Study on cracking of electrolessly nickel-plated 316 stainless steel after laser welding.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 5, p. 328, doi. 10.19289/j.1004-227x.2021.05.002
- By:
- Publication type:
- Article