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- Title
Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures.
- Authors
Hu, Xiaowu; Xu, Tao; Jiang, Xiongxin; Li, Yulong
- Abstract
The interfacial reaction, morphology, and growth behavior of interfacial intermetallic compound (IMC) between the Sn-3Ag-0.5Cu (in wt%) solder and Ni substrate during reflow at 523 K for 300 s and aging at different temperatures for up to 360 h were investigated, and the growth kinetics of the interfacial Ni-Cu-Sn ternary IMC layers were monitored during the isothermal aging. The experimental results showed that a bi-layer of IMCs including (Cu, Ni)Sn/Ni and (Ni, Cu)Sn was detected at the Sn3Ag0.5Cu/Ni interface. A (Ni, Cu)Sn layer formed at the (Cu, Ni)Sn/Ni interface and once the (Ni, Cu)Sn layer had formed, it grew at an exceptionally rapid rate by consuming the (Cu, Ni)Sn layer. The (Cu, Ni)Sn layer was much thicker than the (Ni, Cu)Sn layer after reflowing, but the (Ni, Cu)Sn layer thickened rapidly and would to be thicker than the (Cu, Ni)Sn layer after prolonged aging. The (Ni, Cu)Sn grains revealed an elongated, rod-like shape while the (Cu, Ni)Sn IMC was Polyhedral shape, which was on the top of (Ni, Cu)Sn phase. The thicknesses of total IMC and (Ni, Cu)Sn increased linearly with square root of aging time, while the thickness of (Cu, Ni)Sn did not increase significantly. The activation energies for the diffusion constants of the total interfacial IMC and (Ni, Cu)Sn IMC layers were obtained by plotting the diffusion constants ( D) as a function of the aging temperature (1/ T), and were 91.43 and 89 KJmol, respectively.
- Subjects
INTERFACIAL reactions; INTERMETALLIC compounds; TEMPERATURE; THERMOCYCLING; SOLDER &; soldering
- Publication
Journal of Materials Science: Materials in Electronics, 2016, Vol 27, Issue 5, p4245
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-016-4288-9