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- Title
Interfacial reactions between pure indium solder and Au/Ni metallization.
- Authors
Huang, Li-Chi; Zhang, Yan-Ping; Chen, Chih-Ming; Hung, Liang-Yih; Wang, Yu-Po
- Abstract
Thermal interface material (TIM) attracts considerable attention as the increasing demands for efficient heat dissipation in high-performance microelectronic packages. Due to high thermal conductivity, pure indium is a promising candidate of TIM. The TIM joint between two adjoining components is constructed by solid–liquid interdiffusion (SLID) reaction between indium and Au/Ni metallization on the adjoining surfaces. An understanding of the formation and growth kinetics of the intermetallic compounds (IMCs) at the In/Au/Ni interface is crucial for the reliability assessment of the TIM joints. In this study, the interfacial reactions between indium and Au/Ni in the SLID and thermal aging processes at 220–260 °C and 100–150 °C, respectively, are investigated. The metallographic analysis indicates that the thin Au layer dissolves rapidly into the molten indium matrix, leaving only one IMC at the In/Ni interface in the SLID and aging reactions. Compositional and crystallographic analyses both confirm that the IMC is Ni28In72 incorporated with a small amount of Au solubility. The thickness evolution of Ni28In72 displays a linear relationship with the square root of reaction time, indicating a diffusion-controlled growth behavior.
- Subjects
INTERFACIAL reactions; INDIUM; THERMAL interface materials; MICROELECTRONIC packaging; SOLDER &; soldering
- Publication
Journal of Materials Science: Materials in Electronics, 2022, Vol 33, Issue 16, p13143
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-022-08253-2