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- Title
Numerical simulation and experimental study on electrodeposition of copper foil with through holes.
- Authors
FEI Xiangyu; GONG Benkui; DONG Zhichao; FENG Rui; SUN Yumei; NIE Jiwei
- Abstract
The electrodeposition of copper foil with thorough holes was simulated using Comsol Multiphysics software. The effects of flow rate of electrolyte and current density on the distribution of copper ions, as well as the effects of current density and interelectrode spacing on the thickness uniformity of copper foil were studied. The simulation results showed that the circulation of electrolyte makes copper ions distribute well, which is beneficial to the electrodeposition of copper foil. The thickness uniformity of copper foil could be improved by distributing pores in an annular array or increasing the interelectrode spacing. The simulation results of the model were in a good agreement with the experimental results.
- Publication
Electroplating & Finishing, 2021, Vol 40, Issue 5, p343
- ISSN
1004-227X
- Publication type
Article
- DOI
10.19289/j.1004-227x.2021.05.006