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- Title
Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process.
- Authors
Dong, Chong; Ma, Haoran; Hussain, MuhammadMuzammal; Sun, Liying; Chen, Jun; Wang, Yunpeng; Li, Xiaogan; Ma, Haitao
- Abstract
Intermetallic compound (IMC) formed on (001) and (111) Cu single crystal has strong orientation and texture characteristics. The special interface morphology and uniform orientation provide a direction for the regulation of IMC growth behavior. In this study, the significant effect of orientation on Cu6Sn5 growth behavior in isothermal aging process was investigated. Synchrotron radiation technology and high pressure air blowing methods were employed to obtain the growth kinetics and the morphology of Cu6Sn5 during the heat preservation stage. The results indicate that scallop-like Cu6Sn5 grains were formed in heat preservation stage. These grains exhibited an abnormal coarsening behavior that their average diameter at a high temperature of 300 °C was smaller than that at a low temperature of 250 °C after aging for 30 min. Besides, the growth orientation and kinetic controlling factor of these interfacial Cu6Sn5 also changed with the increase of reaction time, which was closely related to the appearance of the abnormal coarsening phenomenon. These results are significant and meaningful to the electronic packaging industry.
- Subjects
ISOTHERMAL processes; HIGH pressure (Technology); REGULATION of growth; ELECTRONIC packaging; SYNCHROTRON radiation
- Publication
Journal of Materials Science: Materials in Electronics, 2020, Vol 31, Issue 23, p21335
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-020-04646-3