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- Title
Stress relaxation behavior and low cycle fatigue behavior of bulk SAC 305.
- Authors
Paradee, Gary; Bailey, Eric; Christou, Aris
- Abstract
Bulk SnAgCu samples were mechanically tested to investigate the effect of temperature, frequency and applied stress on the low cycle fatigue and stress relaxation behavior and the corresponding microstructure. Samples were tested under a variety of parameters including applied stresses between 8 and 80 MPa, temperatures of 25, 50, 100 and 150 °C and frequencies of 1, 0.1 and 0.01 Hz, respectively. Samples used for the stress relaxation behavior exhibited plastic behavior with increased softening behavior with increased stress levels, increased temperature and lower frequencies. Bayesian analysis revealed that stress relaxation behavior could be expressed in general by the following expression: ∆σ = AN In the previous expression, Bayesian analysis showed that the testing frequency has an exponential dependency while the temperature has a power law dependency on the parameters A and b. The results of the low cycle fatigue study showed that life decreased with increased applied stress, decreased frequency and increased temperature. Bayesian analysis revealed that the low cycle fatigue behavior could be described by the following expression: ∆ σ = G( logN). Additionally, Bayesian analysis showed that the testing frequency and temperature both have a power law dependency on the parameters G and m.
- Subjects
BULK solids; STRESS relaxation tests; MATERIAL fatigue; BAYESIAN analysis
- Publication
Journal of Materials Science: Materials in Electronics, 2014, Vol 25, Issue 9, p4122
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-014-2138-1