We found a match
Your institution may have rights to this item. Sign in to continue.
- Title
Reliability of lead-free solder joints in CSP device under thermal cycling.
- Authors
Zhang, Liang; Sun, Lei; Guo, Yong-huan; He, Cheng-wen
- Abstract
Finite element method and Garofalo-Arrheninus creep model were combined and used to evaluate the reliability of different lead-free solder joints (SnAgCu, SnAg, SnSb and SnZn) and SnPb solder joints in chip scale package (CSP) 14 × 14 device under thermal cyclic loading. The results show that von Mises stress and equivalent creep strain in each of the four lead-free solder joints and SnPb solder joints were strongly different, increasing in the order SnPb < SnAg < SnSb < SnZn < SnAgCu. It is found that maximum stress-strain concentrates on the top-surface of corner solder joints in the CSP device for all solder joints, and SnAgCu solder joints shows the highest fatigue life among those five kinds of solder joints.
- Subjects
INTEGRATED circuit packaging; SOLDER joints; THERMOCYCLING; RELIABILITY in engineering; FINITE element method; CREEP (Materials); STRAINS &; stresses (Mechanics)
- Publication
Journal of Materials Science: Materials in Electronics, 2014, Vol 25, Issue 3, p1209
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-014-1711-y