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- Title
The Material Optimization and Reliability Characterization of an Indium-Solder Thermal Interface Material for CPU Packaging.
- Authors
Deppisch, Carl; Fitzgerald, Thomas; Raman, Arun; Fay Hua; Zhang, Charles; Pilin Liu; Miller, Mikel
- Abstract
Developing new thermal interface materials (TIMs) is a key activity to meeting package thermal performance requirements for future generations of microprocessors. Indium solder is capable of demonstrating end-of-line performance to meet current technology targets due to its inherent high thermal conductivity. However, improving its reliability performance, particularly in temperature cycling, is a challenge. This study describes the failure mechanism and reliability performance of indium solder TIM as a function of integrated heat spreader metallization thickness, TIM bond line thickness, and die size. Also studeied were the steps taken to improve its temperature cycle performance. Analyses were performed using thermal resistance measurements, scanning-electron microscopy, scanning-acoustic microscopy, and transmission-electron microscopy to characterize the solder TIM thermal performance, interfacial microstructure, and failure mechinism.
- Subjects
SOLDER &; soldering; MICROPROCESSORS; INDIUM; FILLER metal; THERMAL conductivity; MICROSTRUCTURE
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2006, Vol 58, Issue 6, p67
- ISSN
1047-4838
- Publication type
Article
- DOI
10.1007/s11837-006-0186-6