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- Title
Microstructure and Strength of Bump Joints in Photodiode Packages.
- Authors
Kyung-Seob Kim, W. H.; Nam-Kyu Kim, W. H.; Chung-Hee Yu, W. H.; Joong-Jung Kim, W. H.; Eui-Goo Chang
- Abstract
The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joint strength decreased with aging time. The diffraction patterns of Cu6Sn5, scallop-shaped IMCs, and planar-shaped Cu3Sn were characterized by transmission electron microscopy (TEM). The IMCs between Au stud bumps and A1 pads was identified as AlAu2. The formation of Kirkendall voids and the growth of IMCs at the solder joint were found to be a possible mechanism for joint strength reduction.
- Subjects
STRENGTH of materials; MECHANICS (Physics); JOINTS (Engineering); INTERMETALLIC compounds; PHOTODIODES; TRANSMISSION electron microscopy
- Publication
Journal of Electronic Materials, 2004, Vol 33, Issue 1, p70
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-004-0296-2