Back to matchesWe found a matchYour institution may have rights to this item. Sign in to continue.TitleConductive adhesive with transient liquid‐phase sintering technology for high‐power device applications.AuthorsEom, Yong‐Sung; Jang, Keon‐Soo; Son, Ji‐Hye; Bae, Hyun‐Cheol; Choi, Kwang‐SeongPublicationETRI Journal, 2019, Vol 41, Issue 6, p820ISSN1225-6463Publication typeArticleDOI10.4218/etrij.2018-0250