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- Title
GOLD WIRE AND SOLDER JOINT MICROFORCE TESTING USING MICROFORCE TESTER.
- Authors
Chao, Y. C.; Liu, D. S.
- Abstract
Introduces an experimental technique for testing the thermo-mechanical tensile strength of micro-wires and fatigue tests for a single solder ball. History of thermosonic wire bonding; Preparation of the specimen; Description of the noise amplitude factors during the experimental setup.
- Subjects
EXPERIMENTAL design; STRENGTH of materials; MATERIAL fatigue; SOLDER &; soldering; ELECTRIC wire; WIRE bonding (Electronic packaging)
- Publication
Experimental Techniques, 2003, Vol 27, Issue 5, p37
- ISSN
0732-8818
- Publication type
Article
- DOI
10.1111/j.1747-1567.2003.tb00128.x