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- Title
Significantly enhanced ductility of Sn–57Bi–1Ag alloy induced by microstructure modulation from in addition.
- Authors
Xiao, K. X.; Li, C. J.; Gao, P.; Qin, J. H.; Guo, S. X.; Zhao, L. Y.; Zhang, J. T.; He, Q.; Peng, J. B.; Yi, J. H.
- Abstract
Aiming to solve the intrinsic brittleness of Sn–Bi solder alloy, the effects of In element on the microstructure evolution, mechanical and soldering properties were systematically investigated in Sn–57Bi–1Ag-based alloy. It was found that the addition of In could fragment the reticular Bi-rich phase and increase the content of β-Sn phase in the Sn–(57 − x)Bi–1Ag–xIn alloy, which significantly improved the fracture elongation of the In-containing solder alloy. The elongation of Sn–56.0Bi–1Ag–1.0In reached 68.51%, which was 2.3 times that of Sn–57Bi–1Ag (~ 29.68%). What’s more, the fracture mechanism of the alloy changes from brittle fracture to mixed ductile-brittle fracture with the addition of In element, implying a significant progress in solving the brittleness problem of Sn–Bi solder alloy. Meanwhile, compared to Sn–57Bi–1Ag, the lower melting point and solidification temperature of the In-containing solder alloys improved the solderability, which enhances the spreading rate of alloy and results in a maximum spreading rate of 72.00% for the Sn–56.0Bi–1Ag–1.0In. This work provides a valuable guidance for industrial production of solder alloys as it simultaneously improved both the solderability and the ductility of Sn–Bi-based alloys.
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 20, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-023-10946-1