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- Title
Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging.
- Authors
Zhao, Meng; Zhang, Liang; Sun, Lei; Xiong, Ming-yue; Jiang, Nan; Xu, Kai-kai
- Abstract
In this study, the effects of Cu nanoparticles on the melting characteristics, wettability, interfacial reaction and mechanical properties of Sn – xCu (x = 0 , 0. 3 , 0. 7 , 1. 0 , 1. 5 , 2. 0) composite solders were investigated. Results show that the properties of the composite solder containing Cu nanoparticles were improved effectively. With the addition of Cu nanoparticles, the melting point of Sn – xCu solder decreased significantly, and the spreading area and the shear strength were increased by 10.3% and 23.2%, respectively. For the performance, the optimal addition of Cu nanoparticles was 0.7%. In addition, the growth of interfacial intermetallic compounds in Sn – xCu/Cu solder joints was inhibited by adding Cu nanoparticles.
- Subjects
COPPER-tin alloys; MICROELECTRONIC packaging; SOLDER &; soldering; SOLDER joints; MELTING points; INTERMETALLIC compounds
- Publication
International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2020, Vol 34, Issue 8, pN.PAG
- ISSN
0217-9792
- Publication type
Article
- DOI
10.1142/S0217979220500642